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Theoretical and Applied MechanicsPublisher: Serbian Society of Mechanics and Mathematical Institute of the Serbian Academy of Sciences and Arts, BeogradISSN: 1450-5584Issue: 35_1-3Date: 2008Journal Homepage Editorial BoardImpressum   A plastic collapse method for evaluating rotation capacity of full-restrained steel moment connections 191 - 214 Kyungkoo Lee and Božidar Stojadinović   AbstractKeywords: Steel structures; moment connections; rotation capacity; low-cycle fatigue; plastic collapse mechanism; seismic designMSC: 74L15 92C37DOI: 10.2298/TAM0803191L Zbl: 1265.74052 Thermodynamic analysis based on the second-order variations of thermodynamic potentials 215 - 234 Vlado A. Lubarda   AbstractKeywords: Gibbs conditions; internal energy; second-order variations; specific heats; thermodynamic potentialsMSC: 74A15 80A17DOI: 10.2298/TAM0803215L Zbl: 1274.80001 Mechanics of complex bodies: Commentary on the unified modeling of material substructures 235 - 254 Paolo Maria Mariano   AbstractKeywords: Complex bodies; material substructures; covarianceMSC: 05C38 15A15DOI: 10.2298/TAM0803235M Zbl: 1265.74071 On elastic response of disordered triangular lattice during dynamic loading 255 - 265 Sreten Mastilović   AbstractKeywords: Lattice; Discrete Models; Modulus of elasticity; Disorder; Short-time response; Long-time response; Plane strainMSC: 74L15 92C37DOI: 10.2298/TAM0803255M Zbl: 1274.74059 Nanoparticles and the influence of interface elasticity 267 - 286 Changwen Mi and Demitris Kouris   AbstractKeywords: Surface and interface effects; nanoparticles; eigenstrains; finite domain; micromechanicsMSC: 74A50 74M25;DOI: 10.2298/TAM0803267C Zbl: 1274.74213 Hysteretic behavior modeling of elastoplastic materials 287 - 304 Dragoslav Šumarac, Bojan Međo and Nataša Trišović   AbstractKeywords: cyclic plasticity; Preisach model; cyclic bendingMSC: 74C05 74S05DOI: 10.2298/TAM0803287S Zbl: 1199.74004 Thermally induced deformations in die-substrate assembly 305 - 322 Milena Vujošević   AbstractKeywords: die-substrate assembly; flip chip BGA; substrate deflection; warpageMSC: 74A99 74M99DOI: 10.2298/TAM0803305V Zbl: 1182.74045 Article page: <<12

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